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CP160808 Fiches techniques |
Numéro de référence | Description détaillée | Fabricant | ||
35 | CP160808T-900x | Multilayer Chip Beads Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk. 2.Extremely high reliability due to entirely monolithic construction. 3.Low DC resistance struc | TaeJin |
|
34 | CP160808T-800x | Multilayer Chip Beads Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk. 2.Extremely high reliability due to entirely monolithic construction. 3.Low DC resistance struc | TaeJin |
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33 | CP160808T-751x | Multilayer Chip Beads Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk. 2.Extremely high reliability due to entirely monolithic construction. 3.Low DC resistance struc | TaeJin |
|
32 | CP160808T-750x | Multilayer Chip Beads Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk. 2.Extremely high reliability due to entirely monolithic construction. 3.Low DC resistance struc | TaeJin |
|
31 | CP160808T-700x | Multilayer Chip Beads Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk. 2.Extremely high reliability due to entirely monolithic construction. 3.Low DC resistance struc | TaeJin |
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30 | CP160808T-680x | Multilayer Chip Beads Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk. 2.Extremely high reliability due to entirely monolithic construction. 3.Low DC resistance struc | TaeJin |
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29 | CP160808T-601x | Multilayer Chip Beads Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk. 2.Extremely high reliability due to entirely monolithic construction. 3.Low DC resistance struc | TaeJin |
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28 | CP160808T-600x | Multilayer Chip Beads Multilayer Chip Beads / CP TYPE(Large Current)
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk. 2.Extremely high reliability due to entirely monolithic construction. 3.Low DC resistance struc | TaeJin |
Numéro de référence | Description détaillée | Fabricant | |
ASJD1200R085 | Normally-ON Trench Silicon Carbide Power JFET |
Micross |
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B8524 | SAW Components |
TDK |
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BA6343 | Stepping motor driver |
ROHM |
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