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PDF SSF8205U Data sheet ( Hoja de datos )

Número de pieza SSF8205U
Descripción MOSFET ( Transistor )
Fabricantes Silikron 
Logotipo Silikron Logotipo



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Main Product Characteristics:
VDSS
18V
RDS(on) 20mohm(typ.)
ID 4.5A
SOT23-6 
Features and Benefits:
„ Advanced trench MOSFET process technology
„ Special designed for buttery protection, load
switching and general power management
„ Ultra low on-resistance with low gate charge
„ Fast switching and reverse body recovery
„ 150operating temperature
SSF8205U 
D1
G1
G2
D2
S1 S2
Marking and pin
Assignment 
Schematic diagram 
 
 
 
Description:
It utilizes the latest trench processing techniques to achieve the high cell density and reduces the
on-resistance with high repetitive avalanche rating. These features combine to make this design an extremely
efficient and reliable device for use in buttery protection, power switching application and a wide variety of other
applications 
Absolute max Rating:
Parameter
Drain-Source Voltage
Gate-Source Voltage
Drain Current-Continuous@ Current-Pulsed (Note 1)
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
Symbol
VDS
VGS
ID
IDM
PD
TJ,TSTG
Limit
18
±10
4.5
25
1.25
-55 To 150
Unit
V
V
A
A
W
Thermal Resistance
Thermal Resistance,Junction-to-Ambient (Note 2)
RθJA
100 /W
©Silikron Semiconductor CO.,LTD.
2011.05.25
www.silikron.com 
Version :1.0
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SSF8205U pdf
                                
 
 
 
 
 
 
 
 
 
 
  TJ-Junction Temperature()
  Figure 7: Power Dissipation
 
 
 
 
 
 
 
 
 
 
 
  Qg Gate Charge (nC)
  Figure 9Gate Charge
 
 
 
 
 
 
 
 
 
 
 
 
  Figure 11: Safe Operation Area
 
 
 
 
 
SSF8205U 
TJ-Junction Temperature()
Figure 8Drain Current
Vds Drain-Source Voltage (V)
Figure 10: Capacitance vs Vds
©Silikron Semiconductor CO.,LTD.
2011.05.25
www.silikron.com 
Version : 1.0
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