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PDF ESDA14V2-4BF2 Data sheet ( Hoja de datos )

Número de pieza ESDA14V2-4BF2
Descripción QUAD BIDIRECTIONAL TRANSIL-TM ARRAY
Fabricantes STMicroelectronics 
Logotipo STMicroelectronics Logotipo



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No Preview Available ! ESDA14V2-4BF2 Hoja de datos, Descripción, Manual

®
ASD
(Application Specific Devices)
ESDA14V2-4BF2
QUAD BIDIRECTIONAL TRANSIL™ ARRAY
FOR ESD PROTECTION
APPLICATION
Where transient overvoltage protection in ESD
sensitive equipment is required, such as :
Computers
Printers
Communication systems and cellular phones
Video equipment
This device is particularly adapted to the
protection of symmetrical signals.
DESCRIPTION
The ESDA14V2-4BF2 is a monolithic array
designed to protect up to 4 lines in a bidirectional
way against ESD transients.
The device is ideal for situations where board
space saving is requested.
Flip-Chip
(5 Bumps)
Table 1: Order Code
Part Number
ESDA14V2-4BF2
Marking
EA
FEATURESwww.DataSheet4U.com
4 Bidirectional Transil functions
ESD Protection: IEC61000-4-2 level 4
Stand off voltage: 12 V Min.
Low leakage current < 1 µA
50 W Peak pulse power (8/20 µs)
Figure 1: Pin Configuration (Bump side)
A1 A3 C1 C3
BENEFITS
High ESD protection level
High integration
Suitable for high density boards
COMPLIES WITH THE FOLLOWING STANDARDS:
IEC61000-4-2
15 kV
8 kV
(air discharge)
(contact discharge)
MIL STD 883F- Method 3015-7: class3
25 kV
(human body model)
GND
Figure 2: Pin Configuration (Bump Side)
32 1
A
B
C
TM: TRANSIL is a trademark of STMicroelectronics.
January 2006
REV. 3
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ESDA14V2-4BF2 pdf
Figure 12: Ordering Information Scheme
ESDA14V2-4BF2
ESDA 14V2 - 4 B Fx
ESD Array
Breakdown Voltage
14V2 = 14.2 Volts min.
Number of line
4 = 4 lines
Type
B = Bidirectional
Package
F = Flip-Chip
x = 2: Leadfree Pitch = 500µm, Bump = 315µm
Figure 13: FLIP-CHIP Package Mechanical Data
700µm ± 50
315µm ± 50
650µm ± 65
1.12 mm ± 50µm
Figure 14: Foot print recommendations
Copper pad Diameter :
250µm recommended , 300µm max
Solder stencil opening : 330µm
Solder mask opening recommendation :
340µm min for 315µm copper pad diameter
Figure 15: Marking
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
E
xxz
y ww
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