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PDF RM807 Data sheet ( Hoja de datos )
| Número de pieza | RM807 | |
| Descripción | Power Amplifier Module | |
| Fabricantes | Skyworks Solutions | |
| Logotipo |  |
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RM807
Power Amplifier Module for TDMA PCS (1850–1910 MHz)
The RM807 Power Amplifier Module (PAM) for Personal Communications Service Distinguishing Features
(PCS) is a fully matched 6-pin surface mount module developed for PCS and wireless • Low voltage positive bias supply
local loop applications. This small and efficient power amplifier packs a full
• Good linearity
1850–1910 MHz bandwidth coverage into a single compact package. This device
• High efficiency
meets the stringent spectral linearity requirements of Time Division Multiple Access • Large dynamic range
(TDMA) PCS transmission with high power added efficiency to output power of
• 6-pin LCC package
www.DataSheet4U.c2o9m.5 dBm. A single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (6 x 6 x 1.5 mm)
(MMIC) contains all active circuitry in the module. The MMIC contains onboard bias • Power down control
circuitry as well as input and interstage matching circuits. The output match is
realized off-chip within the module package to optimize efficiency and power
performance into a 50 ohm load. This device is manufactured with Skyworks’ GaAs Applications
Heterojunction Bipolar Transistor (HBT) process that provides for all positive voltage • Personal Communications
DC supply operation while maintaining high efficiency and good linearity. Primary bias Services (TDMA)
to the RM807 can be supplied directly from a three-cell nickel cadmium, single cell • Wireless Local Loop (WLL)
lithium ion, or other suitable battery with output in the 3–4 volts range. Power down is
accomplished by setting the voltage on the low current reference pin to zero volts. No
external supply side switch is needed as typical “off” leakage is a few microamperes
with full primary voltage supplied from the battery.
Functional Block Diagram
VREF
(3)
VCC1
(1)
VCC2
(4)
RF
Input
(2)
Driver
Stage Bias
Power
Stage Bias
Input
Match
Inter
DA Stage
Match
MMIC
PA
Output
Match
RF
Output
(5)
(6, 7)
GND
Data Sheet
© 2001, Skyworks Solutions, Inc., All Rights Reserved.
(6, 7)
GND
MODULE
100409F
February 7, 2002
1 page  
RM807
Power Amplifier Module for TDMA PCS (1850–1910 MHz)
Characterization Data
Characterization Data
The following charts illustrate the characteristics of a typical RM807 Power Amplifier tested in the
evaluation board described in the following section. The amplifier was selected by characterizing a
group of devices and choosing a part with average electrical performance at both nominal and
worst case conditions. Figures 1 through 5 illustrate the digital signal characteristics of the RM807.
Figure 1. Digital Gain vs. Output Power
www.DataSheet4U.com
40
Vref = 3.1V, Vcc = 3.5V
35
30
25
20
15
10
0
5 10 15 20 25 30
Output Pow er (dBm )
1850 MHz@-30 C
1880 MHz@-30 C
1910 MHz@-30 C
100409F
February 7, 2002
1850 MHz@+85 C
1880 MHz@+85 C
1910 MHz@+85 C
Skyworks
1850 MHz@+25 C
1880 MHz@+25 C
1910 MHz@+25 C
5
5 Page 
RM807
Power Amplifier Module for TDMA PCS (1850–1910 MHz)
Electrostatic Discharge Sensitivity
www.DataSheet4U.com
Electrostatic Discharge Sensitivity
The RM807 is a Class I device. Figure 10 lists the Electrostatic Discharge (ESD) immunity level
for each pin of the RM807 product. The numbers in Figure 10 specify the ESD threshold level for
each pin where the I-V curve between the pin and ground starts to show degradation. The ESD
testing was performed in compliance with MIL-STD-883E Method 3015.7 using the Human Body
Model. Since 2000 volts represents the maximum measurement limit of the test equipment used,
pins marked > 2000 V pass 2000V ESD stress.
Figure 10. ESD Sensitivity Areas
> +2000 V VCC1
< –2000 V
1
> +2000 V RFIN
< –2000 V
2
> +2000 V VREF
< –2000 V
3
6 GND
5
RFOUT
>
<
+2000
–2000
V
V
4
VCC2
> +2000 V
< –2000 V
100409_008
Various failure criteria can be utilized when performing ESD testing. Many vendors employ
relaxed ESD failure standards which fail devices only after “the pin fails the electrical specification
limits” or “the pin becomes completely non-functional”. Skyworks employs most stringent criteria,
fails devices as soon as the pin begins to show any degradation on a curve tracer.
To avoid ESD damage, latent and visible, it is very important that the product assembly and test
areas follow the Class-1 ESD handling precautions listed in Table 6.
Table 6. Precautions for GaAs ICs with ESD Thresholds Greater Than 200V But Less Than 2000V
Personnel Grounding
Wrist Straps
Conductive Smocks, Gloves and Finger Cots
Antistatic ID Badges
Facility
Relative Humidity Control and Air Ionizers
Dissipative Floors (less than 109 Ω to GND)
Protective Workstation
Dissipative Table Tops
Protective Test Equipment (Properly Grounded)
Grounded Tip Soldering Irons
Conductive Solder Suckers
Static Sensors
Protective Packaging & Transportation
Bags and Pouches (Faraday Shield)
Protective Tote Boxes (Conductive Static Shielding)
Protective Trays
Grounded Carts
Protective Work Order Holders
100409F
February 7, 2002
Skyworks
11
11 Page | ||
| Páginas | Total 14 Páginas | |
| PDF Descargar | [ Datasheet RM807.PDF ] | |
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