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PDF BTM7710GP Data sheet ( Hoja de datos )
| Número de pieza | BTM7710GP | |
| Descripción | TrilithIC | |
| Fabricantes | Infineon Technologies | |
| Logotipo |  |
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Datasheet, Rev. 1.0, July 2008
BTM7710GP
TrilithIC
Automotive Power
1 page  
BTM7710GP
Table 1
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
Pin Definitions and Functions
Symbol Function
IL1 Analog input of low-side switch 1
NC Not connected
SL1 Source of low-side switch 1
NC Not connected
SH1 Source of high-side switch 1
GND Ground of high-side switches
IH1 Digital input of high-side switch 1
DHVS Drain of high-side switches and power supply voltage
ST Status; open Drain output
IH2 Digital input of high-side switch 2
SH2 Source of high-side switch 2
NC Not connected
IL2 Analog input of low-side switch 2
NC Not connected
SL2 Source of low-side switch 2
DL2 Drain of low-side switch 2
Heat-Slug 3 or Heat-Dissipator
DHVS Drain of high-side switches and power supply voltage
Heat-Slug 2 or Heat-Dissipator
DL1 Drain of low-side switch 1
Heat-Slug 1 or Heat-Dissipator
Pins written in bold type need power wiring.
Datasheet
5 Rev. 1.0, 2008-07-07
5 Page 
BTM7710GP
5.2 Functional Range
Pos. Parameter
5.2.1 Supply voltage
5.2.2
5.2.3
5.2.4
5.2.5
Input voltage HS
Input voltage LS
Status output current
Junction temperature
Symbol Limit Values
min.
max.
VS VUVOFF 42
VIH
– 0.3
15
VIL
– 0.3
20
IST 0
2
Tj – 40 110
Unit
V
V
V
mA
°C
Remarks
After VS rising above
VUVON
–
–
–
–
Note: Within the functional range the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the related electrical characteristics table
5.3 Thermal Resistance
Pos. Parameter
Symbol
Limit Values
Unit Conditions
Min. Typ. Max.
5.3.1 LS-junction to Case1)
RthJC L – – 1.7 K/W measured to pin 3 or 12
5.3.2 HS-junction to Case1)
RthJC H – – 1.7 K/W measured to pin 19
5.3.3
Junction to Ambient1)
RthJA = Tj(HS) / (P(HS)+ P(LS))
RthJA
–
16 –
K/W 2)
1) Not subject to production test, specified by design.
2) Specified RthJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The Product
(chip+package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).
Where applicable a thermal via array under the exposed pad contacted the first inner copper layer.
5.4 Electrical Characteristics
ISH1 = ISH2 = ISL1 = ISL2 = 0 A; – 40 °C < Tj < 110 °C; 8 V < VS < 18 V
unless otherwise specified
Pos. Parameter
Symbol Limit Values
min. typ.
Current Consumption HS-switch
5.4.4 Quiescent current
IS – 5
5.4.5
5.4.6
5.4.7
5.4.8
Supply current;
one HS-switch active
Supply current;
both HS-switches active
Leakage current of
high-side switch
Leakage current through logic GND
in free wheeling condition
–
IS –
IS –
ISH LK
–
ILKCL = IFH + –
ISH
–
1.5
3
–
–
max.
9
12
3
6
6
10
Unit Test Condition
μA IH1 = IH2 = 0 V
Tj = 25 °C
μA IH1 = IH2 = 0 V1)
mA IH1 or IH2 = 5 V
VS = 12 V
mA IH1 and IH2 = 5 V
VS = 12 V
μA VIH = VSH = 0 V
VS = 12 V
mA IFH = 3 A
VS = 12 V
Datasheet
11 Rev. 1.0, 2008-07-07
11 Page | ||
| Páginas | Total 17 Páginas | |
| PDF Descargar | [ Datasheet BTM7710GP.PDF ] | |
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