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PDF STPTIC-27L2 Data sheet ( Hoja de datos )
| Número de pieza | STPTIC-27L2 | |
| Descripción | tunable integrated capacitor | |
| Fabricantes | STMicroelectronics | |
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STPTIC-27L2
Parascan™ tunable integrated capacitor
6737,&
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Features
• High power capability
• 5:1 tuning range
• Higher linearity (48x)
• High quality factor (Q)
• Low leakage current
• Compatible with high voltage control IC
(STHVDAC series)
• Available in WLCSP package 0.75 x 1.00 x 0.3
mm
• ECOPACK®2 compliant component
Benefit
• RF tunable passive implementation in mobile
phones to optimize antenna radiated
performance
Applications
• Cellular antenna open loop tunable matching
network in multi-band GSM/WCDMA/LTE
mobile phone
• Open loop tunable RF filters
Datasheet - production data
Description
The ST integrated tunable capacitor offers
excellent RF performance, low power
consumption and high linearity required in
adaptive RF tuning applications. The fundamental
building block of PTIC is a tunable material called
Parascan™, which is a version of barium
strontium titanate (BST) developed by Paratek
Microwave.
BST capacitors are tunable capacitors intended
for use in mobile phone application and dedicated
to RF tunable applications. These tunable
capacitors are controlled through an extended
bias voltage ranging from 1 to 24 V. The
implementation of BST tunable capacitors in
mobile phones enables significant improvement
in terms of radiated performance making the
performance almost insensitive to the external
environment.
Figure 1. PTIC functional block diagram
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December 2015
This is information on a product in full production.
TM: Parascan is a trademark of Paratek Microwave Inc.
DocID028611 Rev 1
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www.st.com
1 page  
STPTIC-27L2
2 Package information
Package information
• Epoxy meets UL94, V0
• Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
2.1 Flip-Chip package information
Figure 7. Flip-Chip package outline
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The land pattern below is recommended for soldering the STPTIC-G2 on PCB.
NC stands for No Connect, this pad must not be connected on application board. Please
leave this pad floating.
Table 4. Flip-Chip package dimensions
Dimensions (in microns)
A1 A2 B1 B2 B4 C1 C2 D1 D2 D3 E1 E2
STPTIC-27L2
Tolerance
1000 750 140 500 360 105 540 225 90 315 125 165
±30 ±30 ±15 ±10 ±15 ±15 ±10 ±20 ±20 ±40 ±20 ±20
DocID028611 Rev 1
5/10
10
5 Page | ||
| Páginas | Total 10 Páginas | |
| PDF Descargar | [ Datasheet STPTIC-27L2.PDF ] | |
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